Transko热敏SMD晶体,CT16移动通信晶振,CT16-F1010CQ110-27.000M-TR,尺寸1.6x1.2mm,频率27MHZ,特兰斯科欧美晶振,欧美石英晶振,1612小体积晶振,石英晶体,石英SMD晶体,无源贴片晶振,水晶振动子,轻薄型晶振,热敏晶振,SMD晶振,石英晶体谐振器,四脚贴片晶振,无源晶振,低损耗晶振,低功耗晶振,移动通信晶振,网络设备晶振,物联网晶振,智能家居晶振,平板电脑晶振,蓝牙模块晶振,数字视频晶振,具备出色的可靠性能。
石英贴片晶振产品比较适合用于移动通信,网络设备,物联网,智能家居,平板电脑,蓝牙模块,数字视频等应用。Transko热敏SMD晶体,CT16移动通信晶振,CT16-F1010CQ110-27.000M-TR.
Transko热敏SMD晶体,CT16移动通信晶振,CT16-F1010CQ110-27.000M-TR 参数表
| FREQUENCY RANGE | 27.000 MHz | ||||||||||
| FREQUENCY TOLERANCE @ 25 °C | ±10 ppmmax. (See P/N guide for other options) | ||||||||||
| FREQUENCY STABILITY | ±10 ppmmax. (See P/N guide for other options) | ||||||||||
| OPERATING TEMPERATURE RANGE | -30 °C ~ 85 °C(See P/N guide for other options) | ||||||||||
| STORAGE TEMPERATURE RANGE | -40 °C ~ 85 °C | ||||||||||
| LOAD CAPACITANCE | 8 pF, 10 pF, 12 pF(See P/N guide for other options) | ||||||||||
| SHUNT CAPACITANCE | 3 pF max. | ||||||||||
| DRIVE LEVEL | 100 µW max. | ||||||||||
| AGING @ 25°C | ±3.0 ppm / 1styear max. | ||||||||||
| EQUIVALENT SERIES RESISTANCE | 100 Ω max. | ||||||||||
| OPERATION MODE | Fundamental | ||||||||||
| THERMISTOR RESISTANCE @ 25 °C | 100 K? | ||||||||||
| THERMISTOR B-CONSTANT @ 25 ~ 50 °C | 4250 | ||||||||||
Transko热敏SMD晶体,CT16移动通信晶振,CT16-F1010CQ110-27.000M-TR 尺寸图
Transko热敏SMD晶体,CT16移动通信晶振,CT16-F1010CQ110-27.000M-TR
晶振产品特性:
热敏SMD晶体(1.6 x 1.2 x 0.65mm)
高频稳定性
出色的热耦合
用于移动通信





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