FMI小体积晶振,FMXMC2S118HJC-16.000000M-CM,电信6G晶振

产品简介

FMI小体积晶振,FMXMC2S118HJC-16.000000M-CM,电信6G晶振，美国进口晶振，FMI晶振，型号：FMXMC2S，编码为：FMXMC2S118HJC-16.000000M-CM，频率为：16.000MHz，小体积晶振尺寸：3.2x2.5mm表面安装陶瓷封装，四脚贴片晶振，石英晶振，无源晶振，石英晶体谐振器，SMD晶体，贴片石英晶振，无铅晶振，工作温度范围：-40℃至+85℃。具有超小型，轻薄型，高可靠性紧密稳定性，高精度，高性能，高品质，耐热及耐环境特点。该贴片晶振被广泛应用于：通讯设备，无线网络，蓝牙模块，物联网，汽车电子，医疗设备，安防设备，平板电脑，智能手机，数码电子，智能家居等应用。

产品详情

FMI小体积晶振,FMXMC2S118HJC-16.000000M-CM,电信6G晶振参数表

Parameter	Specification
Frequency Range	16.000MHz
Operation Mode	See Operation Mode and ESR Table
Load Capacitance (CL)	18 pF Std, 8 - 60 pF and Series available
Frequency Tolerance	±30 ppm @ 25℃ Std (See Cal. Tol. for Options)
Temperature Tolerance	±50 ppm Std (See Temp. Tol. for Options)
Operating Temperature	-10 to +60℃ Std (See Temp. Range for Options)
Storage Temperature	-40 to +85℃
Equivalent Series Resistance (ESR)	See Operation Mode and ESR Table
Shunt Capacitance (C0)	5 pF max
Drive Level	10 uW typical, 200 uW max
Aging @ 25℃	±5 ppm per year max
Insulation Resistance	500MΩ min at 100VDC ±15V
Reflow Conditions	+260℃ ±10℃ for 10 sec max 2 reflows max